Orthodyne Electronics Heavy Wire Bonder tradenote.net

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	Orthodyne Electronics Heavy Wire Bonder (07/29/2005) Specifications: Almost new OE Heavy wire bonder. Two units attached to a Grohmann automatic controller frame. Used only in R&D labs. Made around 1998 in excellent condition. On-site installation, and training available. Machines are in USA. Free shipping to China. $79,000 total cost for both. [Related Categories: ] [Related Keywords: ]


	Reflow Oven (07/16/2005) Specifications: Conceptronic APPOLLO SI Reflow Oven (Large Conceptronic),90" X 315" X 69",480V-3P,356A - Maxium; 150A - stable operation,36" x 315", Speeds 0-100 Inch Per Minute, Temp. Range 22 Deg. C to 300 Deg. C,14 Heating Zones,4 Cooling Zones, Lead Free Capability, weight 1100 pounds, made in 1998, total h [Related Categories: ] [Related Keywords: ]


	Grohmann SMD Placer (05/17/2005) Specifications: Grohmann Engineering SMD Placement, 102" X 110" X 92", 480V, AC, 36" x 60" Axis Cap., (54) Pick in Place Heads, (4) 3D Pick in Place Heads. Chip feeders are not included. Egnineers exerienced difficulty in programming routes for the head movements. May need to calibrate all heads before operatio [Related Categories: ] [Related Keywords: ]

Orthodyne Electronics Heavy Wire Bonder

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